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Good News: The organizing committee has announced ICSIP 2025 in Wuxi (China) during July 12-14, 2025.

Special Session: Reconfigurable Intelligent Surface for 6G Communication Networks

Reconfigurable intelligent surface (RIS) has been widely regarded as a disruptive technology for its capability of supporting cost-effective, spectral-efficient and energy-efficient high data rates for 6G communication networks. After several years of research and development, active RIS has been proposed to further amplify the reflected signals based on the initial passive RIS. Meanwhile, RIS with the function of reflecting signals merely has been further improved into simultaneously transmitting and reflecting RIS (STAR-RIS), achieving 360-degree full coverage of incident signals through the performance of simultaneous transmission and reflection. At present, RIS has been jointly designed with a great deal of wireless communication systems to improve the performance of system throughput, signal power, signal-to-interference-plus-noise ratio (SINR), spectral efficiency, energy efficiency, quality-of-service (QoS), data rate, secrecy rate, etc.

The aim of this special session is to show the latest research results in the field of RIS for 6G communication networks. The scope of this special session includes, but is not limited to the following topics:

  • RIS-assisted multi-cell or multi-group communication system;
  • RIS-assisted directional modulation (DM) or spatial modulation (SM) communication system;
  • RIS-assisted millimeter wave (mmWave) or terahertz (THz) communication system;
  • RIS-assisted non-orthogonal multiple access (NOMA) or rate-splitting multiple access (RSMA) system;
  • RIS-assisted orthogonal frequency division multiplexing (OFDM) or orthogonal time frequency space (OTFS) system;
  • RIS-assisted unmanned aerial vehicle (UAV) or satellite communication system;
  • RIS-assisted cognitive radio (CR) network system;
  • RIS-assisted full-duplex (FD) communication system;
  • RIS-assisted device-to-device (D2D) communication system;
  • RIS-assisted multiple-user (MU) physical-layer service integration (PHY-SI) system;
  • RIS-assisted wireless powered sensor network (WPSN) system;
  • RIS-assisted simultaneous wireless information and power transfer (SWIPT) system;
  • RIS-assisted integrated sensing and communications (ISAC) system;
  • RIS-assisted physical layer security (PLS) transmission;
  • Multi-RISs-assisted communication system;
  • Active RIS-assisted communication system;
  • STAR-RIS-assisted communication system.
  • CHAIRMANS:

    Tianming Ma, Shanghai University of Engineering Science (SUES), China (马天鸣,上海工程技术大学,副教授)

    Tianming (Tian-Ming) Ma received Ph.D. degree from Shanghai institute of Microsystem and Information Technology (SIMIT), Chinese Academy of Sciences (CAS), Shanghai, China in 2012. He was a post-doctoral researcher and obtained the first-class general financial grant from the China Postdoctoral Science Foundation in Tsinghua University, Beijing, China from 2012 to 2014. Now he is an associate professor in the School of Electronic & Electrical Engineering (SEEE), Shanghai University of Engineering Science (SUES), Shanghai, China and serve as the leader of the intelligent wireless perception research team in SEEE. He has authored/co-authored over 50 journal/conference papers and held 10 Chinese authorized invention patents as the first inventor or as a mentor for graduate students, of which 3 have already achieved technology transfer. He is a member of IEEE ComSoc & IEEE SPS, a senior member of CIC, a senior member & life member of CIE, a life member of SCS, and a council member of SHIE. He has served as an OC member/TPC member/Track Chair/Workshop Chair/Session Chair/Special Session Chair/Publicity Chair/Moderator/Invited Speaker of many international conferences and received Outstanding Organization Award. He has also served as an official reviewer for many domestic and international journals in the field of communications, such as IEEE TWC, IEEE TVT, IEEE CNCOMM, IEEE CL, IEEE SPL, CJE, JC, JEIT, JSEE, JCIN, JCUPT, JXD, etc. His current interests include 6G multiple access technologies & waveform technologies.

    Jie Jin, Shanghai University of Engineering Science (SUES), China (金婕,上海工程技术大学,副教授)

    Jie Jin received the M.S. degree in communication engineering from Tianjin University in 2003. She joined Beijing Microelectronic Technology Institute and participated in design and implementation of several communication chips. She got Ph.D. degree at Institute of Microelectronics, Peking University. She is now working in the School of Electronic and Electrical Engineering (SEEE), Shanghai University of Engineering Science (SUES), Shanghai, China as an associate professor and her research areas include AI algorithm, wireless communication, SOC design methodology and network chip.


    Wenjing Lv, Shanghai University of Engineering Science (SUES), China (吕文静,上海工程技术大学,讲师)

    Wenjing Lv received the Ph.D. degree in Computer Science and Technology from Tongji University, Shanghai, China, in 2021. She is currently a lecturer with the School of Electronic and Electrical Engineering (SEEE), Shanghai University of Engineering Science (SUES), Shanghai, China. Her current research interests include network coding wireless communications and Artificial Intelligence etc. She has published multiple papers in referred journals and conferences, including IEEE Internet of Things Journal (JCR region 1 journal) etc.


    Nannan Zhang, Shanghai University of Engineering Science (SUES), China (张楠楠,上海工程技术大学,讲师)

    Nannan Zhang received the B.S. degree from the Northeastern University, Shenyang, China, in 2016, and the Ph.D. degree from the Zhejiang University, Hangzhou, China, in 2024. She is currently a lecture with the School of Electronic and Electrical Engineering (SEEE), Shanghai University of Engineering Science (SUES), Shanghai, China. Her research interests mainly focus on wireless edge caching for low-delay communications, reconfigurable intelligent surface assisted communications, and some related applications in wireless communications.

    The manuscript should be submitted via the submission link (http://confsys.iconf.org/submission/icsip2025), or to icsip2016@vip.163.com before the submission deadline (April 05, 2025).

    Call for papers

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